In the LED industry chain, the upstream is the epitaxial manufacturing and chip manufacturing of LED luminescent materials, the midstream is the LED device packaging industry, and the downstream is the industry formed after the application of LED display or lighting devices. The development of packaging technology with low thermal resistance, excellent optical properties and high reliability is the only way for new LEDs to become practical and market.
Packaging is the link between the industry and the market. Only after packaging can it become a terminal product and put into practical application.
During the Mini LED packaging process, if there are particulate pollutants, oxides and epoxy resin pollutants on the chip and the substrate, it will directly affect the yield of Mini LED products. Before dispensing and wire bonding in the packaging process Plasma cleaning prior to encapsulation and curing can effectively remove these contaminants.
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