China Electronics Manufacturing Automation & Resources Exhibition (CMM) is the only exhibition jointly sponsored by electronic manufacturing factories, which comprehensively displays automation, manufacturing environment, quality control technology, tooling, process materials, intelligent warehousing, information technology and other resources to meet the various needs of electronic factories on the road of intelligent manufacturing transformation.
TP screen, glass
Coating, ink printing, coating, pasting, remove static electricity, dust and oil, improve hydrophilicity, prolong the service life of coating and printing.
Semiconductor Industry
Chip bonding pretreatment, lead frame surface treatment, semiconductor packaging, BGA packaging, Wire BOnda pretreatment, COB, COG, COF, ACF processes, effectively remove surface oily dirt and organic pollutant particles, and improve packaging stability.
PCB/FPC
Metal bonding pretreatment, plastic sealing pretreatment, underfill pretreatment, photoresist removal, substrate surface activation, coating, removing static electricity and organic pollutants, and improving hydrophilicity.
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