Sindin Small Lecture Hall | Application of Microwave Plasma Cleaner in Semiconductor Packaging

Microwave PLASMA

Microwave Plasma Helps Semiconductor Packaging Process

With the continuous development of technology, the requirements for semiconductor packaging are getting higher and higher, and microwave plasma cleaning, which improves the packaging quality, has become an indispensable process. The purpose of cleaning is to thoroughly remove particles, organic and inorganic impurities from the surface of the equipment to ensure product quality.At present, plasma cleaning technology has been highly valued and widely recognized by the society due to its outstanding advantages.

①Pre-treatment of die bonding

Removing material surface contaminants and oxides facilitates solder reflow, improves chip-to-carrier connection, reduces peeling, and improves heat dissipation performance.

②Pretreatment of metal bonding

Removes organic contaminants from metal pads, removes thin contamination surfaces, and improves bond strength and bond wire pull uniformity.

③Removal of photoresist

Remove residual photoresist and other organics, activate and roughen wafer surface, and improve wafer surface wettability.

④Pretreatment before plastic sealing

Remove the contaminants on the surface of the material, make the chip surface and the plastic packaging material firmly bonded, and reduce the generation of defects such as delamination and air bubbles.

Semiconductor packaging

PLASMA handles total solutions

SPV-100MWR is a microwave plasma cleaning machine for semiconductor packaging. It is equipped with a magnetic fluid rotating frame, which increases the uniformity of plasma treatment, provides efficient and uniform microwave plasma output, and ensures etching efficiency.

R & D innovation
Achieve domestic substitution

After years of continuous R&D investment and technology accumulation, Shengding has successively developed microwave plasma cleaning machines, online chip microwave plasma cleaning machines, offline microwave plasma degumming machines and other equipment, which can be used in the packaging process of the semiconductor industry, as well as for Plasma activation, adhesive removal, and etching in the wafer fabrication process.